Specialist manufacturers of microelectronic components for optoelectronic, semiconductor, hybrid and microwave applications, specialising in metallised ceramics and metal components and assemblies
Laser World of Photonics – post-show update
LEW Techniques exhibited at Munich’s Laser World of Photonics in June, to showcase its capabilities in precision sub-mounts and carriers for laser diodes, laser bars, laser stacks and photodiodes.
Technical Director, Andrew Walker, was on the stand and commented: “This biannual exhibition is the main event in Europe to showcase our range of products for the mounting of optoelectronic devices. We welcomed a steady stream of visitors to our stand over the four days of the show, both new contacts who are often surprised at the wide range of parts that we manufacture, and existing customers who are keen to discuss ongoing, potential and new projects. There was significant interest in our precision W/Cu laser bar mounts as well as our C-Mount and AlN single-emitter carriers. Of particular interest were some large-scale, fully-working examples of AuSn-coated W/Cu carriers, manufactured specifically to more easily demonstrate the quality and precision of the miniature components we make.”
He added “LEW Techniques has specialised for over 50 years in the manufacture of miniature components for the mounting and interconnect of semiconductor devices. Over that time, we have seen technologies emerge and decline, but optoelectronics continues to show strong and solid growth. It was a very encouraging and productive show for us”
The company would like to thank everyone who visited the stand at the exhibition. If you would like to be informed of our future news and events, sign up to our mailing list here.
Precision in miniature
LEW Techniques specialises in the manufacture of miniature components for the mounting of semiconductor devices. Our in-house capabilities include thin film, thick film and refractory metallising of ceramics and metals, electroplating, precision dicing, laser machining and marking, atmosphere/vacuum brazing and solder assembly.
To ensure end user compatibility, comprehensive in-house testing includes eutectic die bonding, Au wire bonding, shear strength, peel strength, coating thickness and surface finish measurement, heat testing and He leak detection.
Working closely with our customers’ product development teams we are able to help develop extremely technical, high-quality, cost-effective products, bringing them quickly to market, regardless of their location.