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Contract
manufacturing and assembly
Our extensive knowledge and experience
of component and package manufacturing
puts us in an excellent position
to undertake various package assembly,
installation and modification processes
for customers who wish to outsource
this activity.
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Component
and package recovery
Microelectronic parts can be expensive.
We can dismantle, recover and re-package
components and therefore cut costs.
Recovered parts can be restored to
original condition, re-plated, measured,
inspected and re-packaged. Delicate
parts can be disassembled from soldered
or epoxied constructions. Soiled parts
can be cleaned and re-packaged. |
| Component
and assembly design is created in
close co-operation with the user,
working to the strictest code of customer
confidentiality. |
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