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LEW TECHNIQUES EXPANDS THIN-FILM FACILITIES
LEW Techniques Ltd is pleased to announce the addition of further thin-film coating facilities. The expansion brings sputter deposition processes alongside thin-film evaporation techniques.
The additional capability will expand LEW Techniques' thin-film provision to current customers and extends an even more comprehensive thin-film coating service to the microelectronics industry at large, both locally in the UK and internationally.
Industries served by LEW Techniques’ thin-film facility include telecommunications, aerospace, medical and automotive and typical applications include photonics/optoelectronics, hybrids and MCMs, high-frequency devices (RF/microwave) and MEMs/MOEMs devices.
Features include:
• Multi-level metallisations
• Solid vias and plated through holes
• Integrated resistors to 0.2% tolerance
• Sputtered or plated conductor layers
• Air bridges
• Photolith patterning
• Selective plating
• Au/Sn solder layers
• Laser profiled substrates
• Wraparound
Metallisations include:
Aluminium, chrome, copper, gold, gold/tin, nichrome, nickel, palladium, platinum, tantalum, titanium, tungsten/titanium, titanium.
Common metallisation schemes include:
Ti-Pt-Au, Ti/W-Au, Ti/W-Pd-Au, NiCr-Au, TaN-Ti/W-Au, AuSn
Dielectrics and resistors:
Silicon nitride, polyimide, nichrome, tantalum nitride.
LEW Techniques has a wide range of equipment and processes, providing a comprehensive thin-film service. These include sputter deposition, e-beam deposition; liquid resist spinning, dry film lamination; laser cutting, laser drilling, resistor trimming; wet chemical processing and diamond sawing.
For further information or to discuss a design please contact us.
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| Show Report, September 2002 - Angled
Photodiode / Back Facet Monitor Submounts, Copper Tungsten
- Kovar - Alumina Assemblies, Package Modification and
Reclaim, Conductive Silicon Precision Spacers / Chip Mounts |
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ANGLED
PHOTODIODE / BACK FACET MONITOR SUBMOUNTS
- LEW Techniques displayed precision miniature alumina/aluminium
nitride mounting blocks with angled faces. Pre-mounted
die are presented to a beam at an angle by the angled
face of the block itself, achieving diversion of back
reflection in a small package floorspace.
Assembly is also simpler than installing to the angles
required by squared blocks leading to greater conformance,
repeatability and improved yields.
Blocks can be made in a range of sizes with faces angled
as required, incorporating advanced features such as wraparound
metallisation and pre-soldering with Au/Sn. |
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CU/W
- KOVAR - ALUMINA ASSEMBLIES -
LEW Techniques displayed the joining of copper tungsten
to other metals such as kovar to form miniature heatsinks,
sub-carriers and other assemblies. Parts can be machined
to tight tolerances, electroplated and joined to other
metals and ceramic using various solder/braze hierarchies.
The emergence of higher power laser diode devices requires
materials with better thermal conductivity than materials
previously used to mount components and integrate them.
Copper tungsten provides improved thermal conductivity
for the |
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| mounting and integration of high
power laser diode devices (CTE of 6.5 to 8.3 Ppm/°K and thermal
conductivity of 175 to 200 W/mK). The addition of a kovar carrier
and metallised ceramics to a copper tungsten baseplate adds
laser weldability and flexibility of interconnect and test. |
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PACKAGE
MODIFICATION/RECOVERY - LEW Techniques
displayed package modification options including, but
not limited to, replacing fibre spouts, changes to feedthroughs
and seals and modifications to interconnect.
Recovery options include removal of components, epoxies,
solders or wire bonds; refreshing of plating, renovation
of lid seal areas and repair of seals.
Surplus stock can be modified, and reject stock can be
recovered into useable condition, providing new packages
in small quantities if required and with a quick turnaround.
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| CONDUCTIVE SILICON PRECISION
SPACERS / CHIP MOUNTS - Au or Au/Sn
coated LEW Techniques displayed conductive silicon heatsinks
/ spacers / chip mounts, typically used for mounting laser diodes,
or as precision spacers in optical sub-assemblies. These are
lower cost compared to conductive silicon carbide or wraparound
metallised AlN or CVD diamond. Typical properties are:
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| Thermal Conductivity: |
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145
W/m K |
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typically
<0.01 ohm-cm |
| Coatings: |
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1µ
Au or 3µ Au/Sn (one or both sides, or mixed) |
| Thickness: |
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typically
254µ ± 5µ (30µ minimum) |
| Exceptional flatness and parallelism,
Au Patterning optional |
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QUALITY COSTS LESS - LEW
TECHNIQUES QUALITY ACHIEVEMENT
We think that the quality of our products and
all the aspects of the service associated with them is of paramount
importance. Sometimes this level of quality, initially, costs
a little more, but it is a great deal more costly if a component
fails at a later assembly stage when you have added value to
a relatively low cost component.
We put a lot of effort into making sure all components meet
the customer's specifications. To demonstrate this we are proud
of our quality achievement: over a 2 year period we produced
over 11.5 million components from 205 different custom designs
and had only 0.12% returns.
Automation
One aspect that is of increasing importance is the ability of
all components to be automatically assembled. Physical dimension
tolerances need to be tighter and to be achieved 100% of the
time. Precision in miniature is a speciality of LEW. |
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