| |
Multi-layer
metallising
Layers of conductors spaced by dielectrics
provide complex circuit layout. Track and
gap widths of gold, silver, etc. can be
as small as 0.1mm. Mixed metallisation can
provide for soldering and wire bonding on
the same track.
|
|
 |
 |
Wrap
around metallising
Metallised ceramic circuits with 'wrap around'
connections can be produced on adjacent
perpendicular surfaces enabling wire bonding/soldering
on different planes or surfaces. |
|
|
 |
|
Glazing
Ceramics can be assembled using glasses
to provide structures and hermetic packages,
using low-cost tooling when compared to
co-fire.
|
|
 |
|
Thru-hole
and via metallising
Circuitry on opposing faces can be interconnected
using thru-hole and via fill metallising.
Pins can be soldered into these holes.
|
|
 |
 |
Ceramic
fabrication
Ceramic parts can be shaped to suit the
application; miniature metallised circuits
can be produced on blocks as small as 0.5mm3.
|
|
 |
 |
|
Ceramic
mounting/jumper blocks
Miniature mounts with customer circuitry
can be produced in alumina or higher thermal
conductivity Aluminium Nitride as can
wire bonding standoffs for forming jumper
blocks bonding between circuits, devices
and packaging. Bonding pads can be pre-soldered.
|
|
|
|
|
|
