Other Specialist Techniques and Facilities
  Typical Examples:
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Precision machining - metal
Precision-machined components, lids, pre-forms, spacers, alignment parts, fixtures, etc, made in specialist metals including Kovar, Copper, Cu/W, Molybdenum, S/S, Ni/Fe, all finished to high standards including electroplating.

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Specialist sawing, lapping and polishing
Materials such as ceramic, metal, glass etc. and semiconductor wafers can be grooved, sawn, slotted, ground and lapped to tight tolerances (10 µm) and small size (300 µm). Also fabrication or modification of lenses, ferrules, isolators, tubes, rings, etc.
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Specialist electroplating finishing (in-house)
High reliability electroplating of miniature parts with pure soft Au, grain-modified Au, Ni, electro-less Ni, Cu, etc. All to the exacting requirements demanded by the semiconductor industry.
     

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