Super-sharp-edged laser diode heatsinks – product announcement

L.E.W. Techniques announces high performance laser diode heatsinks with super-sharp edges, very flat and smooth die bonding surfaces, with optional pre-deposited Au/Sn solder. These features enable the positioning of high power laser diodes right to the edge of the mount, facilitating maximum performance of the diode whilst minimising hotspots and voiding. For maximum thermal conductivity mounts such as the “C” type are typically fabricated from Cu with optional expansion compensating W/Cu inserts in the laser bonding area. Alternatively smaller mounts such as the “Q” and “W” type can be fabricated totally from W/Cu. Strongly attached standoff ceramics, with or without tags, are also available.

With the demands for ever-higher output power the need for highly engineered heat sinking mounts increases. To ensure the quality of the critical features is maintained L.E.W. performs all key processing in-house, including ceramic metallising and dicing, braze and solder assembly, electroplating, vacuum deposition of coatings and solders as well as grinding, lapping and precision machining of the sharp edges.

L.E.W. Techniques offers capabilities in photonic miniature component manufacture for the mounting of LEDs, lasers and photodiodes, including monitor submounts, sub-carriers, wraparound connections, heatsinks, hermetic window lids, turnkey packages, C, Q, W and other mounts and thick- and thin- film applications.