| Thin Film Microcircuits |
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| LEW Techniques’ dedicated thin film manufacturing capability offers a build-to-print service for high performance microcircuits on a wide range of materials. From simple single layer interconnects to multilayer, double-sided circuits with fine lines, integrated resistors, inductors, metallised vias and complex substrate profiles, our manufacturing know-how and dedicated in-house facilities allow us to offer a comprehensive and versatile service for demanding applications. |
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| CAPABILITY OUTLINE |
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Various substrate materials including alumina, AlN and quartz
Metallisation schemes suitable for soldering, wire-bonding and epoxy attach
Deposition by sputtering, evaporation and electroplating
Laser profiling and drilling
Fine line circuit definition by photolithography
Circuit realisation by selective plating and wet chemical and plasma etching
Metallised thru holes and filled vias
Resistor trimming to tight tolerances
Solder dams, air bridges and protective coatings
Pre-deposited gold/tin solder (AuSn)
Diamond sawing for superior edge quality
Comprehensive testing facilities to ensure product quality |
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| SUBSTRATES |
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| Standard substrate materials include: |
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As-fired or polished alumina (Al O )
High thermal conductivity aluminium nitride (AlN)
Fused quartz for very high frequency applications
Ferrite
Glass
Silicon |
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| METALLISATION |
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| Typical metallisation schemes include: |
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TiW/Au
TiW/Pd/Au
TiW/Pd/Au/Ni/Au
Ti/Pt/Au
NiCr or TaN |
For epoxy assembly and AuSn soldering
For SnPb, SnAg soldering
For additional soldering leach resistance
Best soldering performance but more costly
For integrated resistors |
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| Patterning |
| Utilising wet or dry film, positive and negative photo resists and high accuracy mask alignment, fine high density lines and features are resolved to create the desired circuit. |
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Line widths |
Typical |
High spec. |
Minimum line width
Minimum gap width
Line/gap tolerance
Line to feature (e.g. hole) |
25 µm
25 µm
±10 µm
±50 µm |
10 µm
10 µm
±3 µm
±25 µm |
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| Resistors |
| Integrated resistors are formed using NiCr or TaN seed layers which are exposed where desired and may be laser trimmed to precise values. |
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| Multilayers |
| Crossovers, air bridges and multilayer circuits can be realised using photo-imagable polyimide as an insulating layer. |
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| Vias |
| Plated thru holes or filled vias can be incorporated to provide localised grounding or front-to-backside connections. |
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| LASER MACHINING |
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| Intricate profiles, pockets, notches and vias can be formed in the substrate before or after metallising. Alignment features, serial numbers and solder dams can also be marked onto the substrate or metallised surfaces. |
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| PRE-DEPOSITED AuSn |
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| AuSn solder can be selectively pre-deposited onto the conductors. This removes the need to use a solder preform. Alignment, thickness and alloy control are dependent upon the underlying conductor metallisation and component geometry. |
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| SINGULATION |
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| Individual circuits can be singulated from the substrate by laser profiling or by scribe and snap. For best edge quality diamond sawing is the preferred method. |
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| For further details please contact us. |
Image are not to scale |
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| PRECISION IN MINIATURE |
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LEW Techniques specialises in the manufacture of miniature components for the mounting of semiconductor devices. Our in-house capabilities include Thin Film, Thick Film and refractory metallising of ceramics and metals, electroplating, precision dicing, laser machining and marking, atmosphere/vacuum brazing and solder assembly.
To ensure end user compatibility, comprehensive in-house testing includes eutectic die bonding, Au wire bonding, shear strength, peel strength, coating thickness and surface finish measurement, heat testing and He leak detection.
To discuss your application in detail please contact our Technical Sales Department who will be pleased to assist you. |
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