Materials
Materials used include:
Ceramics
Alumina (white or black), aluminium nitride, sapphire.
Metals
Gold, kovar, nickel iron alloys, OFHC copper, copper/tungsten, copper/molybdenum, molybdenum.
Metallisations
Electroless/electrolytic platings:
Cu, Ni, Au.
Sputtering and evaporation:
Ti, TiW, NiCr, TaN, Ni, Cu, Pd, Pt, Au, AuSn.
Thick Film:
Au, Pt/Au, Pt/Ag, Pt/Pd/Ag, Ag, Mo.
Other
Silicon, ferrites, zirconia, glass, quartz.
Solders and braze materials
Sn/Pb, Sn/Pb/Ag, Sn/Ag, Au/Sn, Au/Ge, Ag/Cu, Au/Ni, Cu.
For further details please contact us.