Alumina (white or black), aluminium nitride, sapphire.

Gold, kovar, nickel iron alloys, OFHC copper, copper/tungsten, copper/molybdenum, molybdenum.

Electroless/electrolytic platings:
Cu, Ni, Au.

Sputtering and evaporation:
Ti, TiW, NiCr, TaN, Ni, Cu, Pd, Pt, Au, AuSn.

Thick Film:
Au, Pt/Au, Pt/Ag, Pt/Pd/Ag, Ag, Mo.

Silicon, ferrites, zirconia, glass, quartz.

Sn/Pb, Sn/Pb/Ag, Sn/Ag, Au/Sn, Au/Ge, Ag/Cu, Au/Ni, Cu.

For further details please contact us.