LEW Techniques to exhibit at ECOC 2023

LEW TechniquesExhibitions, Latest news

Visit us on stand 474. LEW Techniques will be showing its capabilities in the manufacture of miniature, precision metal and ceramic micro-package components, assemblies and microcircuits for the mounting and interconnect of semiconductor devices. Product types include: Services include: • Photodiode mounts • Thin-film metallising • Thin-film microcircuits • Thick-film … Read more