LEW Techniques to exhibit at Laser World of Photonics

LEW TechniquesLatest news

Join us in Hall B2 on Booth 121 where we will be showing our capabilities in precision submounts and carriers for laser diodes, laser bars, laser stacks and photodiodes.

Product types include submounts made from tungsten/copper (WCu) with super-sharp edges (<5µm radius) which allow the laser diode to be positioned right at the edge of the mount. Precision-machined tungsten/copper inserts can be brazed to solid copper bodies to maximise heat-sinking whilst minimising expansion mismatch between carrier and laser die.

Submounts are also available in aluminium nitride (AlN) with photo-patterned metallisation to provide high-precision circuits. Metal structures can be tailored to meet individual requirements for soldering, wire bonding, electrical and thermal performance.

Both the WCu and AlN style mounts can be selectively coated with a thin layer of AuSn solder (typ. 3-5µm), allowing for laser diodes to be accurately and consistently mounted. Metal coatings and solder alloy consistency are strictly maintained to ensure the best possible reflow results.

Mounts for photodiodes on ceramics with wrap over conductors are available. Circuits can be defined on multiple faces allowing greater interconnect flexibility and the ceramic can be precision machined for greatest functionality.

To see examples of our capabilities please join us at the show, or contact us to discuss your requirements.