LEW Techniques to exhibit at ECOC 2023

LEW TechniquesExhibitions, Latest news

Visit us on stand 474.

LEW Techniques will be showing its capabilities in the manufacture of miniature, precision metal and ceramic micro-package components, assemblies and microcircuits for the mounting and interconnect of semiconductor devices.

Product types include: Services include:
• Photodiode mounts • Thin-film metallising
• Thin-film microcircuits • Thick-film and refractory metallising
• Laser diode heatsinks • Electroplating
• Laser carriers • Chemical and plasma etching
• LED mounts • Diamond precision dicing
• Optical benches • Atmosphere/vacuum brazing and soldering
• Interconnects/jumpers • Laser profiling and marking
• Adaptors • Micromachining
• Hermetic packages • Manual and automated assembly
• Hermetic windows • Custom, outsourced and subcontract manufacture

All in a range of geometries, materials and finishes with optional special features.

Our comprehensive facilities, techniques, knowledge and consideration combine to ensure you receive the quality components your designs demand to provide ultimate assembly yield and device performance.

To see examples of our capabilities and to discuss how we can help you to realise your ideas, please join us on stand 474.